The advancement in processing technology, such as chemical mechanical planarization (CMP) has facilitated the improved performance of the semiconductor devices at relatively lower unit cost, which is driving the growth of the global chemical mechanical planarization market. Chemical mechanical planarization is widely used in ultra-flat surface processing in semiconductor industries. In the recent years, it has become mainstream process for below 0.35 micrometer surface processing in semiconductor industry, which in turn is driving the growth of the global market. The technology for CMP has become advanced over the years. In modern CMP, tungsten as slurry is gradually replacing the oxide based slurry for the contacts and vias in multilayer electronics circuitry.
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The integrated electronic circuits contain several levels, which are separated by insulating dielectric layers (ILD). As multiple circuit layers are constructed on the wafer surface, the issue of non-planarity becomes dominant. Chemical mechanical polarization is widely used to address non-planarity of the electronic circuit design. Moreover, chemical mechanical planarization (CMP) is also used for the high quality finish with minimum of height variation and mirror like finish. However, the process complexity such as unique slurry of materials, superior process setting, polishing and etching, in addition with specific pad for a particular circuit design increases the overall cost of CMP.
Among the types, slurry accounted for the largest and fastest growing segment in the global market in 2014. On the basis of technology, the leading edge accounted for the largest market share in 2014. On the basis of applications, the compound semiconductors segment accounted for the largest market share in the global chemical mechanical planarization market in 2014. Optics is expected to be the fastest growing application segment in the global market during the forecast period.
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Some of the competitors in the global chemical mechanical planarization market are Applied Materials, Inc., Lapmaster Wolters GmbH, Strasbaugh Inc., Cabot Microelectronics Corporation, Fujimi Incorporated, Air Products & Chemicals Inc., Ebara Corporation, LAM Research Corporation, Okamoto Machine Tool Works Ltd., DOW Electronic Materials, and Hitachi Chemical Company Ltd.
Global Chemical Mechanical Planarization Market Segmentation
- Cu Barrier
- Cu Step 1
- Buff 200
- Planarizing 200
- Buff 300
- Cleaning Solutions
- Pad Conditioner
- PVA Brushes
Breakdown by Technology
- Leading Edge
- More Than Moore’s
Breakdown by Application
- MEMS & NEMS
- Compound Semiconductors
- Other Integrated Circuits
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