Encision, a company based in Boulder, Colorado, is releasing its new AEM EndoShield 2 burn protection system. The product is an update on the original EndoShield that prevents stray energy burns from electrosurgical ablation devices. These arise from imperfections in manufacturing or instrument damage during surgery that result in damaged instrument insulation or from capacitive coupling. A lot of the energy can be released along the shaft of the instrument rather than at the tip. The Active Electrode Monitoring technology within the EndoShield keeps an eye on the delivered electricity and prevents stray burns.
The original EndoShield was disposable, ending up being somewhat expensive. The EndoShield 2 is “reposable” and can be used repeatedly without reprocessing, lowering the cost to hospitals.
From Encision’s announcement:
The reposable design provides greater flexibility than ever for hospitals to perform laparoscopic procedures in any open operating room without the need to move expensive capital from room to room. The plug and play architecture of EndoShield 2 enables any standard electrosurgical generator to easily provide advanced levels of patient safety in laparoscopy with Encision’s Active Electrode Monitoring (AEM®) Technology. The ease of use of EndoShield 2 is absolutely intuitive.” “EndoShield 2 will be the cornerstone for Encision’s growth going forward. The low cost reposable design is exactly what our customers have been asking for and what will enable Encision to bring AEM® Technology to new markets worldwide. New products in our development pipeline will leverage from EndoShield 2’s design and capabilities to further accelerate the adoption of advanced AEM monopolar energy and to save patients and healthcare providers from the tragic outcomes of stray energy burns. We are excited to bring this technological advancement to fruition and to take AEM® Technology one step closer to becoming the standard of care for patient safety in laparoscopy.”
Product page: AEM EndoShield 2 Burn Protection System…
Via: Encision…
